Vertical, capacitive microelectromechanical switches produced via direct writing of copper wires

Three-dimensional (3D) direct writing based on the meniscus-confined electrodeposition of copper metal wires was used in this study to develop vertical capacitive microelectromechanical switches. Vertical microelectromechanical switches reduce the form factor and increase the area density of such de...

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Detalles Bibliográficos
Autores principales: Yi, Zhiran, Guo, Jianjun, Chen, Yining, Zhang, Haiqing, Zhang, Shuai, Xu, Gaojie, Yu, Minfeng, Cui, Ping
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group 2016
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6444713/
https://www.ncbi.nlm.nih.gov/pubmed/31057818
http://dx.doi.org/10.1038/micronano.2016.10

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6444713/
https://www.ncbi.nlm.nih.gov/pubmed/31057818
http://dx.doi.org/10.1038/micronano.2016.10

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