Cargando…
Vertical, capacitive microelectromechanical switches produced via direct writing of copper wires
Three-dimensional (3D) direct writing based on the meniscus-confined electrodeposition of copper metal wires was used in this study to develop vertical capacitive microelectromechanical switches. Vertical microelectromechanical switches reduce the form factor and increase the area density of such de...
| Autores principales: | , , , , , , , |
|---|---|
| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Nature Publishing Group
2016
|
| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6444713/ https://www.ncbi.nlm.nih.gov/pubmed/31057818 http://dx.doi.org/10.1038/micronano.2016.10 |