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Thermal transport across grain boundaries in polycrystalline silicene: A multiscale modeling
During the fabrication process of large scale silicene, through common chemical vapor deposition (CVD) technique, polycrystalline films are quite likely to be produced, and the existence of Kapitza thermal resistance along grain boundaries could result in substantial changes of their thermal propert...
| Autores principales: | , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Nature Publishing Group UK
2019
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6450874/ https://www.ncbi.nlm.nih.gov/pubmed/30952974 http://dx.doi.org/10.1038/s41598-019-42187-w |