The Effect of Epoxy Polymer Addition in Sn-Ag-Cu and Sn-Bi Solder Joints

To analyze the reinforcement effect of adding polymer to solder paste, epoxies were mixed with two currently available Sn-3.0Ag-0.5Cu (wt.% SAC305) and Sn-59Bi (wt.%) solder pastes and specimens prepared by bonding chip resistors to a printed circuit board. The effect of repetitive thermal stress on...

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Detalles Bibliográficos
Autores principales: Kang, Min-Soo, Kim, Do-Seok, Shin, Young-Eui
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6470899/
https://www.ncbi.nlm.nih.gov/pubmed/30909434
http://dx.doi.org/10.3390/ma12060960

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6470899/
https://www.ncbi.nlm.nih.gov/pubmed/30909434
http://dx.doi.org/10.3390/ma12060960

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