Molecular Dynamics Simulation on the Effect of Bonding Pressure on Thermal Bonding of Polymer Microfluidic Chip

Thermal bonding technology is the most commonly used approach in bonding injection-molded microfluidic chips. Although the bonding mechanism is still under debate, the molecular dynamics (MD) method can provide insight into the bonding process on a macromolecular level. In this study, MD simulations...

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Detalles Bibliográficos
Autores principales: Zhou, Mingyong, Xiong, Xiang, Drummer, Dietmar, Jiang, Bingyan
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6473845/
https://www.ncbi.nlm.nih.gov/pubmed/30960541
http://dx.doi.org/10.3390/polym11030557

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6473845/
https://www.ncbi.nlm.nih.gov/pubmed/30960541
http://dx.doi.org/10.3390/polym11030557

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