Mechanically strengthened graphene-Cu composite with reduced thermal expansion towards interconnect applications

High-density integration technologies with copper (Cu) through-silicon via (TSV) have emerged as viable alternatives for achieving the requisite integration densities for the portable electronics and micro-electro-mechanical systems (MEMSs) package. However, significant thermo-mechanical stresses ca...

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Detalles Bibliográficos
Autores principales: An, Zhonglie, Li, Jinhua, Kikuchi, Akio, Wang, Zhuqing, Jiang, Yonggang, Ono, Takahito
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6526160/
https://www.ncbi.nlm.nih.gov/pubmed/31123594
http://dx.doi.org/10.1038/s41378-019-0059-0

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6526160/
https://www.ncbi.nlm.nih.gov/pubmed/31123594
http://dx.doi.org/10.1038/s41378-019-0059-0

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