Cargando…
Mechanically strengthened graphene-Cu composite with reduced thermal expansion towards interconnect applications
High-density integration technologies with copper (Cu) through-silicon via (TSV) have emerged as viable alternatives for achieving the requisite integration densities for the portable electronics and micro-electro-mechanical systems (MEMSs) package. However, significant thermo-mechanical stresses ca...
| Autores principales: | , , , , , |
|---|---|
| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Nature Publishing Group UK
2019
|
| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6526160/ https://www.ncbi.nlm.nih.gov/pubmed/31123594 http://dx.doi.org/10.1038/s41378-019-0059-0 |