New development of atomic layer deposition: processes, methods and applications

Atomic layer deposition (ALD) is an ultra-thin film deposition technique that has found many applications owing to its distinct abilities. They include uniform deposition of conformal films with controllable thickness, even on complex three-dimensional surfaces, and can improve the efficiency of ele...

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Detalles Bibliográficos
Autores principales: Oviroh, Peter Ozaveshe, Akbarzadeh, Rokhsareh, Pan, Dongqing, Coetzee, Rigardt Alfred Maarten, Jen, Tien-Chien
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Taylor & Francis 2019
Materias:
Engineering and Structural materials
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6534251/
https://www.ncbi.nlm.nih.gov/pubmed/31164953
http://dx.doi.org/10.1080/14686996.2019.1599694

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6534251/
https://www.ncbi.nlm.nih.gov/pubmed/31164953
http://dx.doi.org/10.1080/14686996.2019.1599694

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