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Novel High Holding Voltage SCR with Embedded Carrier Recombination Structure for Latch-up Immune and Robust ESD Protection

A novel CMOS-process-compatible high-holding voltage silicon-controlled rectifier (HHV-SCR) for electrostatic discharge (ESD) protection is proposed and demonstrated by simulation and transmission line pulse (TLP) testing. The newly introduced hole (or electron) recombination region H-RR (or E-RR) n...

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Detalles Bibliográficos
Autores principales: Wang, Zhuo, Qi, Zhao, Liang, Longfei, Qiao, Ming, Li, Zhaoji, Zhang, Bo
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Springer US 2019
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6538706/
https://www.ncbi.nlm.nih.gov/pubmed/31139957
http://dx.doi.org/10.1186/s11671-019-3017-8
Descripción
Sumario:A novel CMOS-process-compatible high-holding voltage silicon-controlled rectifier (HHV-SCR) for electrostatic discharge (ESD) protection is proposed and demonstrated by simulation and transmission line pulse (TLP) testing. The newly introduced hole (or electron) recombination region H-RR (or E-RR) not only recombines the minority carrier in parasitic PNP (or NPN) transistor base by N+ (or P+) layer, but provides the additional recombination to eliminate the surface avalanche carriers by newly added P+ (or N+) layer in H-RR (or E-RR), which brings about a further improvement of holding voltage (V(h)). Compared with the measured V(h) of 1.8 V of low-voltage triggered silicon-controlled rectifier (LVTSCR), the V(h) of HHV-SCR can be increased to 8.1 V while maintaining a sufficiently high failure current (I(t2) > 2.6 A). An improvement of over four times in the figure of merit (FOM) is achieved.