Highly stacked 3D organic integrated circuits with via-hole-less multilevel metal interconnects

Multilevel metal interconnects are crucial for the development of large-scale organic integrated circuits. In particular, three-dimensional integrated circuits require a large number of vertical interconnects between layers. Here, we present a novel multilevel metal interconnect scheme that involves...

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Detalles Bibliográficos
Autores principales: Yoo, Hocheon, Park, Hongkeun, Yoo, Seunghyun, On, Sungmin, Seong, Hyejeong, Im, Sung Gap, Kim, Jae-Joon
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6546689/
https://www.ncbi.nlm.nih.gov/pubmed/31160606
http://dx.doi.org/10.1038/s41467-019-10412-9

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6546689/
https://www.ncbi.nlm.nih.gov/pubmed/31160606
http://dx.doi.org/10.1038/s41467-019-10412-9

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