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Highly stacked 3D organic integrated circuits with via-hole-less multilevel metal interconnects
Multilevel metal interconnects are crucial for the development of large-scale organic integrated circuits. In particular, three-dimensional integrated circuits require a large number of vertical interconnects between layers. Here, we present a novel multilevel metal interconnect scheme that involves...
| Autores principales: | , , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Nature Publishing Group UK
2019
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6546689/ https://www.ncbi.nlm.nih.gov/pubmed/31160606 http://dx.doi.org/10.1038/s41467-019-10412-9 |