Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration

Fan-out wafer level packaging (FOWLP) is one of the latest packaging trends in microelectronics. Besides technology developments towards heterogeneous integration, including multiple die packaging, passive component integration in packages and redistribution layers or package-on-package approaches,...

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Detalles Bibliográficos
Autores principales: Braun, Tanja, Becker, Karl-Friedrich, Hoelck, Ole, Voges, Steve, Kahle, Ruben, Dreissigacker, Marc, Schneider-Ramelow, Martin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6562530/
https://www.ncbi.nlm.nih.gov/pubmed/31126083
http://dx.doi.org/10.3390/mi10050342

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6562530/
https://www.ncbi.nlm.nih.gov/pubmed/31126083
http://dx.doi.org/10.3390/mi10050342

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