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Fan-Out Wafer and Panel Level Packaging as Packaging Platform for Heterogeneous Integration
Fan-out wafer level packaging (FOWLP) is one of the latest packaging trends in microelectronics. Besides technology developments towards heterogeneous integration, including multiple die packaging, passive component integration in packages and redistribution layers or package-on-package approaches,...
Autores principales: | Braun, Tanja, Becker, Karl-Friedrich, Hoelck, Ole, Voges, Steve, Kahle, Ruben, Dreissigacker, Marc, Schneider-Ramelow, Martin |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2019
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6562530/ https://www.ncbi.nlm.nih.gov/pubmed/31126083 http://dx.doi.org/10.3390/mi10050342 |
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