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PMMA-Based Wafer-Bonded Capacitive Micromachined Ultrasonic Transducer for Underwater Applications

This article presents a new wafer-bonding fabrication technique for Capacitive Micromachined Ultrasonic Transducers (CMUTs) using polymethyl methacrylate (PMMA). The PMMA-based single-mask and single-dry-etch step-bonding device is much simpler, and reduces process steps and cost as compared to othe...

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Detalles Bibliográficos
Autores principales:	Ahmad, Mansoor, Bozkurt, Ayhan, Farhanieh, Omid
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2019
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6562750/ https://www.ncbi.nlm.nih.gov/pubmed/31083578 http://dx.doi.org/10.3390/mi10050319

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