Microstructure and Grain Orientation Evolution in SnPb/SnAgCu Interconnects Under Electrical Current Stressing at Cryogenic Temperature

Electromigration was characterized at the cathode Cu/solder interface—without the effect of Joule heating—by employing scanning electron microscopy (SEM) and electron backscatter diffraction (EBSD) analyses. Rapid (Cu(x),Ni(1−x))(6)Sn(5) intermetallic compound (IMC) growth was observed at the anomal...

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Detalles Bibliográficos
Autores principales: Fu, Xing, En, Yunfei, Zhou, Bin, Chen, Si, Huang, Yun, He, Xiaoqi, Chen, Hongtao, Yao, Ruohe
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6566418/
https://www.ncbi.nlm.nih.gov/pubmed/31096663
http://dx.doi.org/10.3390/ma12101593

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6566418/
https://www.ncbi.nlm.nih.gov/pubmed/31096663
http://dx.doi.org/10.3390/ma12101593

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