Design and Fabrication of Wafer-Level Microlens Array with Moth-Eye Antireflective Nanostructures

Wafer-level packaging (WLP) based camera module production has attracted widespread industrial interest because it offers high production efficiency and compact modules. However, suppressing the surface Fresnel reflection losses is challenging for wafer-level microlens arrays. Traditional dielectric...

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Detalles Bibliográficos
Autores principales: Xie, Shuping, Wan, Xinjun, Yang, Bo, Zhang, Wei, Wei, Xiaoxiao, Zhuang, Songlin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6567065/
https://www.ncbi.nlm.nih.gov/pubmed/31096627
http://dx.doi.org/10.3390/nano9050747

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6567065/
https://www.ncbi.nlm.nih.gov/pubmed/31096627
http://dx.doi.org/10.3390/nano9050747

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