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Design and Fabrication of Wafer-Level Microlens Array with Moth-Eye Antireflective Nanostructures

Wafer-level packaging (WLP) based camera module production has attracted widespread industrial interest because it offers high production efficiency and compact modules. However, suppressing the surface Fresnel reflection losses is challenging for wafer-level microlens arrays. Traditional dielectric...

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Autores principales: Xie, Shuping, Wan, Xinjun, Yang, Bo, Zhang, Wei, Wei, Xiaoxiao, Zhuang, Songlin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6567065/
https://www.ncbi.nlm.nih.gov/pubmed/31096627
http://dx.doi.org/10.3390/nano9050747
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author Xie, Shuping
Wan, Xinjun
Yang, Bo
Zhang, Wei
Wei, Xiaoxiao
Zhuang, Songlin
author_facet Xie, Shuping
Wan, Xinjun
Yang, Bo
Zhang, Wei
Wei, Xiaoxiao
Zhuang, Songlin
author_sort Xie, Shuping
collection PubMed
description Wafer-level packaging (WLP) based camera module production has attracted widespread industrial interest because it offers high production efficiency and compact modules. However, suppressing the surface Fresnel reflection losses is challenging for wafer-level microlens arrays. Traditional dielectric antireflection (AR) coatings can cause wafer warpage and coating fractures during wafer lens coating and reflow. In this paper, we present the fabrication of a multiscale functional structure-based wafer-level lens array incorporating moth-eye nanostructures for AR effects, hundred-micrometer-level aspherical lenses for camera imaging, and a wafer-level substrate for wafer assembly. The proposed fabrication process includes manufacturing a wafer lens array metal mold using ultraprecise machining, chemically generating a nanopore array layer, and replicating the multiscale wafer lens array using ultraviolet nanoimprint lithography. A 50-mm-diameter wafer lens array is fabricated containing 437 accurate aspherical microlenses with diameters of 1.0 mm; each lens surface possesses nanostructures with an average period of ~120 nm. The microlens quality is sufficient for imaging in terms of profile accuracy and roughness. Compared to lenses without AR nanostructures, the transmittance of the fabricated multiscale lens is increased by ~3% under wavelengths of 400–750 nm. This research provides a foundation for the high-throughput and low-cost industrial application of wafer-level arrays with AR nanostructures.
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spelling pubmed-65670652019-06-17 Design and Fabrication of Wafer-Level Microlens Array with Moth-Eye Antireflective Nanostructures Xie, Shuping Wan, Xinjun Yang, Bo Zhang, Wei Wei, Xiaoxiao Zhuang, Songlin Nanomaterials (Basel) Article Wafer-level packaging (WLP) based camera module production has attracted widespread industrial interest because it offers high production efficiency and compact modules. However, suppressing the surface Fresnel reflection losses is challenging for wafer-level microlens arrays. Traditional dielectric antireflection (AR) coatings can cause wafer warpage and coating fractures during wafer lens coating and reflow. In this paper, we present the fabrication of a multiscale functional structure-based wafer-level lens array incorporating moth-eye nanostructures for AR effects, hundred-micrometer-level aspherical lenses for camera imaging, and a wafer-level substrate for wafer assembly. The proposed fabrication process includes manufacturing a wafer lens array metal mold using ultraprecise machining, chemically generating a nanopore array layer, and replicating the multiscale wafer lens array using ultraviolet nanoimprint lithography. A 50-mm-diameter wafer lens array is fabricated containing 437 accurate aspherical microlenses with diameters of 1.0 mm; each lens surface possesses nanostructures with an average period of ~120 nm. The microlens quality is sufficient for imaging in terms of profile accuracy and roughness. Compared to lenses without AR nanostructures, the transmittance of the fabricated multiscale lens is increased by ~3% under wavelengths of 400–750 nm. This research provides a foundation for the high-throughput and low-cost industrial application of wafer-level arrays with AR nanostructures. MDPI 2019-05-15 /pmc/articles/PMC6567065/ /pubmed/31096627 http://dx.doi.org/10.3390/nano9050747 Text en © 2019 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Xie, Shuping
Wan, Xinjun
Yang, Bo
Zhang, Wei
Wei, Xiaoxiao
Zhuang, Songlin
Design and Fabrication of Wafer-Level Microlens Array with Moth-Eye Antireflective Nanostructures
title Design and Fabrication of Wafer-Level Microlens Array with Moth-Eye Antireflective Nanostructures
title_full Design and Fabrication of Wafer-Level Microlens Array with Moth-Eye Antireflective Nanostructures
title_fullStr Design and Fabrication of Wafer-Level Microlens Array with Moth-Eye Antireflective Nanostructures
title_full_unstemmed Design and Fabrication of Wafer-Level Microlens Array with Moth-Eye Antireflective Nanostructures
title_short Design and Fabrication of Wafer-Level Microlens Array with Moth-Eye Antireflective Nanostructures
title_sort design and fabrication of wafer-level microlens array with moth-eye antireflective nanostructures
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6567065/
https://www.ncbi.nlm.nih.gov/pubmed/31096627
http://dx.doi.org/10.3390/nano9050747
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