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Design and Fabrication of Wafer-Level Microlens Array with Moth-Eye Antireflective Nanostructures
Wafer-level packaging (WLP) based camera module production has attracted widespread industrial interest because it offers high production efficiency and compact modules. However, suppressing the surface Fresnel reflection losses is challenging for wafer-level microlens arrays. Traditional dielectric...
| Autores principales: | , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
MDPI
2019
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6567065/ https://www.ncbi.nlm.nih.gov/pubmed/31096627 http://dx.doi.org/10.3390/nano9050747 |