Suppressed Growth of (Fe, Cr(,) Co(,) Ni(,) Cu)Sn(2) Intermetallic Compound at Interface between Sn-3.0Ag-0.5Cu Solder and FeCoNiCrCu(0.5) Substrate during Solid-state Aging

High-entropy alloys (HEAs) are promising materials for next-generation applications because of their mechanical properties, excellent high-temperature stability, and resistance against oxidation and corrosion. Although many researchers have investigated high-temperature HEA applications, few have co...

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Detalles Bibliográficos
Autores principales: Shen, Yu-An, Lin, Chun-Ming, Li, Jiahui, Gao, Runhua, Nishikawa, Hiroshi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6629638/
https://www.ncbi.nlm.nih.gov/pubmed/31308462
http://dx.doi.org/10.1038/s41598-019-46757-w

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6629638/
https://www.ncbi.nlm.nih.gov/pubmed/31308462
http://dx.doi.org/10.1038/s41598-019-46757-w

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