A Novel Seedless TSV Process Based on Room Temperature Curing Silver Nanowires ECAs for MEMS Packaging

The through-silicon-vias (TSVs) process is a vital technology in microelectromechanical systems (MEMS) packaging. The current via filling technique based on copper electroplating has many shortcomings, such as involving multi-step processes, requiring sophisticated equipment, low through-put and pro...

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Detalles Bibliográficos
Autores principales: Meng, Min, Cheng, Lijuan, Yang, Kai, Sun, Mingyan, Luo, Yi
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6631795/
https://www.ncbi.nlm.nih.gov/pubmed/31141971
http://dx.doi.org/10.3390/mi10060351

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6631795/
https://www.ncbi.nlm.nih.gov/pubmed/31141971
http://dx.doi.org/10.3390/mi10060351

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