Research on the Protrusions Near Silicon-Glass Interface during Cavity Fabrication

Taking advantage of good hermeticity, tiny parasitic capacitance, batch mode fabrication, and compatibility with multiple bonding techniques, the glass-silicon composite substrate manufactured by the glass reflow process has great potential to achieve 3D wafer-level packaging for high performance. H...

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Detalles Bibliográficos
Autores principales: Zhang, Meng, Yang, Jian, He, Yurong, Yang, Fan, Zhao, Yongmei, Xue, Fen, Han, Guowei, Si, Chaowei, Ning, Jin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6631805/
https://www.ncbi.nlm.nih.gov/pubmed/31234592
http://dx.doi.org/10.3390/mi10060420

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6631805/
https://www.ncbi.nlm.nih.gov/pubmed/31234592
http://dx.doi.org/10.3390/mi10060420

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