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Rapid Evaluation of Electron Mobilities at Semiconductor–Insulator Interfaces in an Ambient Atmosphere by a Contactless Microwave-Based Technique
[Image: see text] Intrinsic mobility of electrons at the interfaces between crystalline organic semiconductors and insulating dielectric polymer films was rapidly evaluated in an ambient atmosphere by TRMC@Interfaces, a noncontact and nondestructive method based on dielectric loss spectroscopy of mi...
Autores principales: | , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
American Chemical Society
2017
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Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6640973/ https://www.ncbi.nlm.nih.gov/pubmed/31457218 http://dx.doi.org/10.1021/acsomega.6b00428 |
Sumario: | [Image: see text] Intrinsic mobility of electrons at the interfaces between crystalline organic semiconductors and insulating dielectric polymer films was rapidly evaluated in an ambient atmosphere by TRMC@Interfaces, a noncontact and nondestructive method based on dielectric loss spectroscopy of microwaves. By just preparing simple metal–insulator–semiconductor devices, local-scale motions of charge carriers injected into the interface by pulses of gate bias voltage were monitored through reflected microwave changes, resulting in the evaluation of local-scale charge carrier mobilities together with the value of trap density at the interface. The evaluated high electron mobilities of 12 cm(2) V(–1) s(–1) for N,N′-bis(cyclohexyl)naphthalene-1,4,5,8-bis(dicarboximide) (DCy-NDI) and 15 cm(2) V(–1) s(–1) for N,N′-dioctylperylene-1,4,5,8-bis(dicarboximide) (DC(8)-PDI) are the benchmarks for organic semiconducting materials that are comparable with the highest ones reported from the field-effect transistor devices. The present TRMC@Interfaces was found to serve as a rapid screening technique to examine the intrinsic performance of organic semiconducting materials as well as a useful tool enabling the precise discussion on the relationship among their local-scale charge carrier mobility, thin-film morphology, and packing structure. |
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