One-Step Fabrication of Copper Nanopillar Array-Filled AAO Films by Pulse Electrodeposition for Anisotropic Thermal Conductive Interconnectors

[Image: see text] By using pulse electrodeposition, a copper nanopillar array (CuNPA) was filled into porous anodized aluminum oxide (AAO) films to achieve a highly thermal conductive interconnector with anisotropic property. After 120 min pulse deposition, CuNPA uniformly filled the pores of AAO wi...

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Detalles Bibliográficos
Autores principales: Wang, Shang, Tian, Yanhong, Wang, Chenxi, Hang, Chunjin, Zhang, He, Huang, Yuan, Zheng, Zhen
Formato: Online Artículo Texto
Lenguaje:English
Publicado: American Chemical Society 2019
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6648779/
https://www.ncbi.nlm.nih.gov/pubmed/31459756
http://dx.doi.org/10.1021/acsomega.8b03533

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6648779/
https://www.ncbi.nlm.nih.gov/pubmed/31459756
http://dx.doi.org/10.1021/acsomega.8b03533

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