Molecular Dynamics Simulations of Atomic Diffusion during the Al–Cu Ultrasonic Welding Process

Ultrasonic welding (UW) is an important joining technique in the electrical industry. Molecular dynamic simulation has been shown to possess several advantages for revealing the evolution of the atomic-scale structure and the interpretation of diffusion mechanisms at the microscopic level. However,...

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Detalles Bibliográficos
Autores principales: Yang, Jingwei, Zhang, Jie, Qiao, Jian
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6678988/
https://www.ncbi.nlm.nih.gov/pubmed/31330930
http://dx.doi.org/10.3390/ma12142306

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6678988/
https://www.ncbi.nlm.nih.gov/pubmed/31330930
http://dx.doi.org/10.3390/ma12142306

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