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Achieving High Thermal Conductivity in Epoxy Composites: Effect of Boron Nitride Particle Size and Matrix-Filler Interface

For the thermal management of high watt density circuit layers, it is common to use a filled epoxy system to provide an electrically insulating but thermally conducting bond to a metal substrate. An epoxy-thiol system filled with boron nitride (BN), in the form of 2, 30 and 180 µm platelets, has bee...

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Detalles Bibliográficos
Autores principales: Moradi, Sasan, Calventus, Yolanda, Román, Frida, Hutchinson, John M
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6680888/
https://www.ncbi.nlm.nih.gov/pubmed/31284564
http://dx.doi.org/10.3390/polym11071156