Fluidic Self-Assembly on Electroplated Multilayer Solder Bumps with Tailored Transformation Imprinted Melting Points

This communication presents fluidic self-assembly of Si-chip on a sequentially electroplated multilayer solder bump with tailored transformation imprinted melting points. The multilayer solder bump is a lead free ternary solder system, which provides a route to transform the melting point of interco...

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Detalles Bibliográficos
Autores principales: Kaltwasser, Mahsa, Schmidt, Udo, Lösing, Lars, Biswas, Shantonu, Stauden, Thomas, Bund, Andreas, Jacobs, Heiko O.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6683123/
https://www.ncbi.nlm.nih.gov/pubmed/31383873
http://dx.doi.org/10.1038/s41598-019-47690-8

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6683123/
https://www.ncbi.nlm.nih.gov/pubmed/31383873
http://dx.doi.org/10.1038/s41598-019-47690-8

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