Numerical evaluation of cooling performances of semiconductor using CuO/water nanofluids

Now a days Very-Large-Scale Integrated (VLSI) circuits are facing critical issues to satisfy the cooling demand because of shrinking the semiconductors. In this numerical work, the surface temperature of the chip, heat transfer rate, thermal resistance, power consumption and reliability are studied...

Descripción completa

Detalles Bibliográficos
Autores principales: Mukesh Kumar, P.C., Arun Kumar, C.M.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Elsevier 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6698882/
https://www.ncbi.nlm.nih.gov/pubmed/31440592
http://dx.doi.org/10.1016/j.heliyon.2019.e02227

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6698882/
https://www.ncbi.nlm.nih.gov/pubmed/31440592
http://dx.doi.org/10.1016/j.heliyon.2019.e02227

Ejemplares similares