Cargando…

Numerical evaluation of cooling performances of semiconductor using CuO/water nanofluids

Now a days Very-Large-Scale Integrated (VLSI) circuits are facing critical issues to satisfy the cooling demand because of shrinking the semiconductors. In this numerical work, the surface temperature of the chip, heat transfer rate, thermal resistance, power consumption and reliability are studied...

Descripción completa

Detalles Bibliográficos
Autores principales: Mukesh Kumar, P.C., Arun Kumar, C.M.
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Elsevier 2019
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6698882/
https://www.ncbi.nlm.nih.gov/pubmed/31440592
http://dx.doi.org/10.1016/j.heliyon.2019.e02227
_version_ 1783444634562723840
author Mukesh Kumar, P.C.
Arun Kumar, C.M.
author_facet Mukesh Kumar, P.C.
Arun Kumar, C.M.
author_sort Mukesh Kumar, P.C.
collection PubMed
description Now a days Very-Large-Scale Integrated (VLSI) circuits are facing critical issues to satisfy the cooling demand because of shrinking the semiconductors. In this numerical work, the surface temperature of the chip, heat transfer rate, thermal resistance, power consumption and reliability are studied by using CuO/water nanofluids as coolant and compared the nanofluids results with the results of water. The CuO/water nanofluids at 0.25%, 0.5%, and 0.75% volume concentration are used for this investigation. The modelling, meshing and simulation are carried out by CATIAv5 and ANSYS Fluent v12 CFX software package. It is observed that the heat transfer rates of semiconductor using the coolant CuO/water nanofluid at 0.25%, 0.5%, and 0.75% volume concentrations are 25%, 43%, and 57% respectively higher than that of water. Found that the surface temperature of the semiconductor is lowered by 3%, 6%, and 8%, the thermal resistances decrease up to 6%, 10%, and 13%, and the Nusselt number increases by 25%, 43%, and 56%, when compared to water. It is also studied that the power consumption of the semiconductor reduces by 3%, 6%, and 8% at 0.25%, 0.5%, and 0.75% volume concentration respectively than water as coolant. It is also found that the failure rate of the semiconductor of using CuO/water nanofluids at 0.25%, 0.5%, and 0.75% volume concentration are 69%, 76%, and 84% respectively smaller than the water.
format Online
Article
Text
id pubmed-6698882
institution National Center for Biotechnology Information
language English
publishDate 2019
publisher Elsevier
record_format MEDLINE/PubMed
spelling pubmed-66988822019-08-22 Numerical evaluation of cooling performances of semiconductor using CuO/water nanofluids Mukesh Kumar, P.C. Arun Kumar, C.M. Heliyon Article Now a days Very-Large-Scale Integrated (VLSI) circuits are facing critical issues to satisfy the cooling demand because of shrinking the semiconductors. In this numerical work, the surface temperature of the chip, heat transfer rate, thermal resistance, power consumption and reliability are studied by using CuO/water nanofluids as coolant and compared the nanofluids results with the results of water. The CuO/water nanofluids at 0.25%, 0.5%, and 0.75% volume concentration are used for this investigation. The modelling, meshing and simulation are carried out by CATIAv5 and ANSYS Fluent v12 CFX software package. It is observed that the heat transfer rates of semiconductor using the coolant CuO/water nanofluid at 0.25%, 0.5%, and 0.75% volume concentrations are 25%, 43%, and 57% respectively higher than that of water. Found that the surface temperature of the semiconductor is lowered by 3%, 6%, and 8%, the thermal resistances decrease up to 6%, 10%, and 13%, and the Nusselt number increases by 25%, 43%, and 56%, when compared to water. It is also studied that the power consumption of the semiconductor reduces by 3%, 6%, and 8% at 0.25%, 0.5%, and 0.75% volume concentration respectively than water as coolant. It is also found that the failure rate of the semiconductor of using CuO/water nanofluids at 0.25%, 0.5%, and 0.75% volume concentration are 69%, 76%, and 84% respectively smaller than the water. Elsevier 2019-08-07 /pmc/articles/PMC6698882/ /pubmed/31440592 http://dx.doi.org/10.1016/j.heliyon.2019.e02227 Text en © 2019 Published by Elsevier Ltd. http://creativecommons.org/licenses/by-nc-nd/4.0/ This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).
spellingShingle Article
Mukesh Kumar, P.C.
Arun Kumar, C.M.
Numerical evaluation of cooling performances of semiconductor using CuO/water nanofluids
title Numerical evaluation of cooling performances of semiconductor using CuO/water nanofluids
title_full Numerical evaluation of cooling performances of semiconductor using CuO/water nanofluids
title_fullStr Numerical evaluation of cooling performances of semiconductor using CuO/water nanofluids
title_full_unstemmed Numerical evaluation of cooling performances of semiconductor using CuO/water nanofluids
title_short Numerical evaluation of cooling performances of semiconductor using CuO/water nanofluids
title_sort numerical evaluation of cooling performances of semiconductor using cuo/water nanofluids
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6698882/
https://www.ncbi.nlm.nih.gov/pubmed/31440592
http://dx.doi.org/10.1016/j.heliyon.2019.e02227
work_keys_str_mv AT mukeshkumarpc numericalevaluationofcoolingperformancesofsemiconductorusingcuowaternanofluids
AT arunkumarcm numericalevaluationofcoolingperformancesofsemiconductorusingcuowaternanofluids