Vapor-deposited zeolitic imidazolate frameworks as gap-filling ultra-low-k dielectrics

The performance of modern chips is strongly related to the multi-layer interconnect structure that interfaces the semiconductor layer with the outside world. The resulting demand to continuously reduce the k-value of the dielectric in these interconnects creates multiple integration challenges and e...

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Detalles Bibliográficos
Autores principales: Krishtab, Mikhail, Stassen, Ivo, Stassin, Timothée, Cruz, Alexander John, Okudur, Oguzhan Orkut, Armini, Silvia, Wilson, Chris, De Gendt, Stefan, Ameloot, Rob
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6700180/
https://www.ncbi.nlm.nih.gov/pubmed/31427584
http://dx.doi.org/10.1038/s41467-019-11703-x

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6700180/
https://www.ncbi.nlm.nih.gov/pubmed/31427584
http://dx.doi.org/10.1038/s41467-019-11703-x

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