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Vapor-deposited zeolitic imidazolate frameworks as gap-filling ultra-low-k dielectrics
The performance of modern chips is strongly related to the multi-layer interconnect structure that interfaces the semiconductor layer with the outside world. The resulting demand to continuously reduce the k-value of the dielectric in these interconnects creates multiple integration challenges and e...
| Autores principales: | , , , , , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Nature Publishing Group UK
2019
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6700180/ https://www.ncbi.nlm.nih.gov/pubmed/31427584 http://dx.doi.org/10.1038/s41467-019-11703-x |