Fabrication of Micro-Punch Array by Plasma Printing for Micro-Embossing into Copper Substrates

Copper substrates were wrought to have micro-grooves for packaging by micro-stamping with use of a AISI316 stainless steel micro-punch array. The micro-texture of this arrayed punch was first tailored and compiled into CAD data. A screen film was prepared to have the tailored micro-pattern in corres...

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Detalles Bibliográficos
Autores principales: Shiratori, Tomomi, Aizawa, Tatsuhiko, Saito, Yasuo, Dohda, Kuniaki
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6719215/
https://www.ncbi.nlm.nih.gov/pubmed/31430966
http://dx.doi.org/10.3390/ma12162640

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6719215/
https://www.ncbi.nlm.nih.gov/pubmed/31430966
http://dx.doi.org/10.3390/ma12162640

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