Low Conductivity Decay of Sn–0.7Cu–0.2Zn Photovoltaic Ribbons for Solar Cell Application

The present study applied Sn–0.7Cu–0.2Zn alloy solders to a photovoltaic ribbon. Intermetallic compounds of Cu(6)Sn(5) and Ag(3)Sn formed at the Cu/solder/Ag interfaces of the module after reflow. Electron probe microanalyzer images showed that a Cu–Zn solid-solution layer (Zn accumulation layer) ex...

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Detalles Bibliográficos
Autores principales: Chen, Kuan-Jen, Hung, Fei-Yi, Lui, Truan-Sheng, Hsu, Lin
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6723640/
https://www.ncbi.nlm.nih.gov/pubmed/31430967
http://dx.doi.org/10.3390/mi10080550

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6723640/
https://www.ncbi.nlm.nih.gov/pubmed/31430967
http://dx.doi.org/10.3390/mi10080550

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