Study of the effect of Sn grain boundaries on IMC morphology in solid state inter-diffusion soldering

This paper reports on 3D phase field simulations of IMC growth in Co/Sn and Cu/Sn solder systems. In agreement with experimental micrographs, we obtain uniform growth of the CoSn(3) phase in Co/Sn solder joints and a non-uniform wavy morphology for the Cu(6)Sn(5) phase in Cu/Sn solder joints. Furthe...

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Detalles Bibliográficos
Autores principales: Hou, Lin, Moelans, Nele, Derakhshandeh, Jaber, De Wolf, Ingrid, Beyne, Eric
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6795889/
https://www.ncbi.nlm.nih.gov/pubmed/31619710
http://dx.doi.org/10.1038/s41598-019-51179-9

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6795889/
https://www.ncbi.nlm.nih.gov/pubmed/31619710
http://dx.doi.org/10.1038/s41598-019-51179-9

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