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Study of the effect of Sn grain boundaries on IMC morphology in solid state inter-diffusion soldering
This paper reports on 3D phase field simulations of IMC growth in Co/Sn and Cu/Sn solder systems. In agreement with experimental micrographs, we obtain uniform growth of the CoSn(3) phase in Co/Sn solder joints and a non-uniform wavy morphology for the Cu(6)Sn(5) phase in Cu/Sn solder joints. Furthe...
| Autores principales: | , , , , |
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| Formato: | Online Artículo Texto |
| Lenguaje: | English |
| Publicado: |
Nature Publishing Group UK
2019
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| Materias: | |
| Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6795889/ https://www.ncbi.nlm.nih.gov/pubmed/31619710 http://dx.doi.org/10.1038/s41598-019-51179-9 |