Highly Plasmonic Titanium Nitride by Room-Temperature Sputtering

Titanium nitride (TiN) has recently emerged as an attractive alternative material for plasmonics. However, the typical high-temperature deposition of plasmonic TiN using either sputtering or atomic layer deposition has greatly limited its potential applications and prevented its integration into exi...

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Detalles Bibliográficos
Autores principales: Chang, Chun-Chieh, Nogan, John, Yang, Zu-Po, Kort-Kamp, Wilton J. M., Ross, Willard, Luk, Ting S., Dalvit, Diego A. R., Azad, Abul K., Chen, Hou-Tong
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6814862/
https://www.ncbi.nlm.nih.gov/pubmed/31653881
http://dx.doi.org/10.1038/s41598-019-51236-3

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6814862/
https://www.ncbi.nlm.nih.gov/pubmed/31653881
http://dx.doi.org/10.1038/s41598-019-51236-3

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