Soldering of Passive Components Using Sn Nanoparticle Reinforced Solder Paste: Influence on Microstructure and Joint Strength

In this study, the effects of adding Sn nanopowder (particle size < 150 nm) to three solder pastes SAC3-X(H)F3+, SCAN-Ge071-XF3+, and water washable WW50-SAC3 are evaluated regarding microstructure, morphology, joint strength, and electrical resistance. The nanopowder was added at a rate of 10% b...

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Detalles Bibliográficos
Autores principales: Atieh, Anas M., Abedalaziz, Tala J., AlHazaa, Abdulaziz, Weser, Michael, Al-Kouz, Wael G., Sari, Maen S., Alhoweml, Ibrahim
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6835952/
https://www.ncbi.nlm.nih.gov/pubmed/31627380
http://dx.doi.org/10.3390/nano9101478

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6835952/
https://www.ncbi.nlm.nih.gov/pubmed/31627380
http://dx.doi.org/10.3390/nano9101478

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