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Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films

The effect of copper substrate roughness and tin layer thickness were investigated on whisker development in the case of Sn thin-films. Sn was vacuum-evaporated onto both unpolished and mechanically polished Cu substrates with 1 µm and 2 μm average layer thicknesses. The samples were stored in room...

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Detalles Bibliográficos
Autores principales: Illés, Balázs, Hurtony, Tamás, Krammer, Olivér, Medgyes, Bálint, Dušek, Karel, Bušek, David
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6862243/
https://www.ncbi.nlm.nih.gov/pubmed/31684157
http://dx.doi.org/10.3390/ma12213609