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Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films
The effect of copper substrate roughness and tin layer thickness were investigated on whisker development in the case of Sn thin-films. Sn was vacuum-evaporated onto both unpolished and mechanically polished Cu substrates with 1 µm and 2 μm average layer thicknesses. The samples were stored in room...
Autores principales: | , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2019
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6862243/ https://www.ncbi.nlm.nih.gov/pubmed/31684157 http://dx.doi.org/10.3390/ma12213609 |
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author | Illés, Balázs Hurtony, Tamás Krammer, Olivér Medgyes, Bálint Dušek, Karel Bušek, David |
author_facet | Illés, Balázs Hurtony, Tamás Krammer, Olivér Medgyes, Bálint Dušek, Karel Bušek, David |
author_sort | Illés, Balázs |
collection | PubMed |
description | The effect of copper substrate roughness and tin layer thickness were investigated on whisker development in the case of Sn thin-films. Sn was vacuum-evaporated onto both unpolished and mechanically polished Cu substrates with 1 µm and 2 μm average layer thicknesses. The samples were stored in room conditions for 60 days. The considerable stress—developed by the rapid intermetallic layer formation—resulted in intensive whisker formation, even in some days after the layer deposition. The developed whiskers and the layer structure underneath them were investigated with both scanning electron microscopy and ion microscopy. The Sn thin-film deposited onto unpolished Cu substrate produced less but longer whiskers than that deposited onto polished Cu substrate. This phenomenon might be explained by the dependence of IML formation on the surface roughness of substrates. The formation of IML wedges is more likely on rougher Cu substrates than on polished ones. Furthermore, it was found that with the decrease of layer thickness, the development of nodule type whiskers increases due to the easier diffusion of other atoms into the whisker bodies. |
format | Online Article Text |
id | pubmed-6862243 |
institution | National Center for Biotechnology Information |
language | English |
publishDate | 2019 |
publisher | MDPI |
record_format | MEDLINE/PubMed |
spelling | pubmed-68622432019-12-05 Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films Illés, Balázs Hurtony, Tamás Krammer, Olivér Medgyes, Bálint Dušek, Karel Bušek, David Materials (Basel) Article The effect of copper substrate roughness and tin layer thickness were investigated on whisker development in the case of Sn thin-films. Sn was vacuum-evaporated onto both unpolished and mechanically polished Cu substrates with 1 µm and 2 μm average layer thicknesses. The samples were stored in room conditions for 60 days. The considerable stress—developed by the rapid intermetallic layer formation—resulted in intensive whisker formation, even in some days after the layer deposition. The developed whiskers and the layer structure underneath them were investigated with both scanning electron microscopy and ion microscopy. The Sn thin-film deposited onto unpolished Cu substrate produced less but longer whiskers than that deposited onto polished Cu substrate. This phenomenon might be explained by the dependence of IML formation on the surface roughness of substrates. The formation of IML wedges is more likely on rougher Cu substrates than on polished ones. Furthermore, it was found that with the decrease of layer thickness, the development of nodule type whiskers increases due to the easier diffusion of other atoms into the whisker bodies. MDPI 2019-11-03 /pmc/articles/PMC6862243/ /pubmed/31684157 http://dx.doi.org/10.3390/ma12213609 Text en © 2019 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/). |
spellingShingle | Article Illés, Balázs Hurtony, Tamás Krammer, Olivér Medgyes, Bálint Dušek, Karel Bušek, David Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films |
title | Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films |
title_full | Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films |
title_fullStr | Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films |
title_full_unstemmed | Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films |
title_short | Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films |
title_sort | effect of cu substrate roughness and sn layer thickness on whisker development from sn thin-films |
topic | Article |
url | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6862243/ https://www.ncbi.nlm.nih.gov/pubmed/31684157 http://dx.doi.org/10.3390/ma12213609 |
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