Cargando…

Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films

The effect of copper substrate roughness and tin layer thickness were investigated on whisker development in the case of Sn thin-films. Sn was vacuum-evaporated onto both unpolished and mechanically polished Cu substrates with 1 µm and 2 μm average layer thicknesses. The samples were stored in room...

Descripción completa

Detalles Bibliográficos
Autores principales: Illés, Balázs, Hurtony, Tamás, Krammer, Olivér, Medgyes, Bálint, Dušek, Karel, Bušek, David
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6862243/
https://www.ncbi.nlm.nih.gov/pubmed/31684157
http://dx.doi.org/10.3390/ma12213609
_version_ 1783471509113667584
author Illés, Balázs
Hurtony, Tamás
Krammer, Olivér
Medgyes, Bálint
Dušek, Karel
Bušek, David
author_facet Illés, Balázs
Hurtony, Tamás
Krammer, Olivér
Medgyes, Bálint
Dušek, Karel
Bušek, David
author_sort Illés, Balázs
collection PubMed
description The effect of copper substrate roughness and tin layer thickness were investigated on whisker development in the case of Sn thin-films. Sn was vacuum-evaporated onto both unpolished and mechanically polished Cu substrates with 1 µm and 2 μm average layer thicknesses. The samples were stored in room conditions for 60 days. The considerable stress—developed by the rapid intermetallic layer formation—resulted in intensive whisker formation, even in some days after the layer deposition. The developed whiskers and the layer structure underneath them were investigated with both scanning electron microscopy and ion microscopy. The Sn thin-film deposited onto unpolished Cu substrate produced less but longer whiskers than that deposited onto polished Cu substrate. This phenomenon might be explained by the dependence of IML formation on the surface roughness of substrates. The formation of IML wedges is more likely on rougher Cu substrates than on polished ones. Furthermore, it was found that with the decrease of layer thickness, the development of nodule type whiskers increases due to the easier diffusion of other atoms into the whisker bodies.
format Online
Article
Text
id pubmed-6862243
institution National Center for Biotechnology Information
language English
publishDate 2019
publisher MDPI
record_format MEDLINE/PubMed
spelling pubmed-68622432019-12-05 Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films Illés, Balázs Hurtony, Tamás Krammer, Olivér Medgyes, Bálint Dušek, Karel Bušek, David Materials (Basel) Article The effect of copper substrate roughness and tin layer thickness were investigated on whisker development in the case of Sn thin-films. Sn was vacuum-evaporated onto both unpolished and mechanically polished Cu substrates with 1 µm and 2 μm average layer thicknesses. The samples were stored in room conditions for 60 days. The considerable stress—developed by the rapid intermetallic layer formation—resulted in intensive whisker formation, even in some days after the layer deposition. The developed whiskers and the layer structure underneath them were investigated with both scanning electron microscopy and ion microscopy. The Sn thin-film deposited onto unpolished Cu substrate produced less but longer whiskers than that deposited onto polished Cu substrate. This phenomenon might be explained by the dependence of IML formation on the surface roughness of substrates. The formation of IML wedges is more likely on rougher Cu substrates than on polished ones. Furthermore, it was found that with the decrease of layer thickness, the development of nodule type whiskers increases due to the easier diffusion of other atoms into the whisker bodies. MDPI 2019-11-03 /pmc/articles/PMC6862243/ /pubmed/31684157 http://dx.doi.org/10.3390/ma12213609 Text en © 2019 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
spellingShingle Article
Illés, Balázs
Hurtony, Tamás
Krammer, Olivér
Medgyes, Bálint
Dušek, Karel
Bušek, David
Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films
title Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films
title_full Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films
title_fullStr Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films
title_full_unstemmed Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films
title_short Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films
title_sort effect of cu substrate roughness and sn layer thickness on whisker development from sn thin-films
topic Article
url https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6862243/
https://www.ncbi.nlm.nih.gov/pubmed/31684157
http://dx.doi.org/10.3390/ma12213609
work_keys_str_mv AT illesbalazs effectofcusubstrateroughnessandsnlayerthicknessonwhiskerdevelopmentfromsnthinfilms
AT hurtonytamas effectofcusubstrateroughnessandsnlayerthicknessonwhiskerdevelopmentfromsnthinfilms
AT krammeroliver effectofcusubstrateroughnessandsnlayerthicknessonwhiskerdevelopmentfromsnthinfilms
AT medgyesbalint effectofcusubstrateroughnessandsnlayerthicknessonwhiskerdevelopmentfromsnthinfilms
AT dusekkarel effectofcusubstrateroughnessandsnlayerthicknessonwhiskerdevelopmentfromsnthinfilms
AT busekdavid effectofcusubstrateroughnessandsnlayerthicknessonwhiskerdevelopmentfromsnthinfilms