Cargando…

Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films

The effect of copper substrate roughness and tin layer thickness were investigated on whisker development in the case of Sn thin-films. Sn was vacuum-evaporated onto both unpolished and mechanically polished Cu substrates with 1 µm and 2 μm average layer thicknesses. The samples were stored in room...

Descripción completa

Detalles Bibliográficos
Autores principales:	Illés, Balázs, Hurtony, Tamás, Krammer, Olivér, Medgyes, Bálint, Dušek, Karel, Bušek, David
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2019
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6862243/ https://www.ncbi.nlm.nih.gov/pubmed/31684157 http://dx.doi.org/10.3390/ma12213609

Ejemplares similares

Effect of Recrystallization on β to α-Sn Allotropic Transition in 99.3Sn–0.7Cu wt. % Solder Alloy Inoculated with InSb
por: Skwarek, Agata, et al.
Publicado: (2020)

Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates
por: Hurtony, Tamás, et al.
Publicado: (2020)

Application of ZnO Nanoparticles in Sn99Ag0.3Cu0.7-Based Composite Solder Alloys
por: Skwarek, Agata, et al.
Publicado: (2021)

Effect of Ni on the Suppression of Sn Whisker Formation in Sn-0.7Cu Solder Joint
por: Hashim, Aimi Noorliyana, et al.
Publicado: (2021)

Cu(6)Sn(5) Whiskers Precipitated in Sn3.0Ag0.5Cu/Cu Interconnection in Concentrator Silicon Solar Cells Solder Layer
por: Zhang, Liang, et al.
Publicado: (2017)

Effect of Isothermal Annealing on Sn Whisker Growth Behavior of Sn0.7Cu0.05Ni Solder Joint
por: Hashim, Aimi Noorliyana, et al.
Publicado: (2023)

Iron whiskers around SN 1987A
por: Wickramasinghe, N C, et al.
Publicado: (1994)

Influence of Flux and Related Factors on Intermetallic Layer Growth within SAC305 Solder Joints
por: Dušek, Karel, et al.
Publicado: (2021)

Atmospheric Pressure Catalytic Vapor Deposition of Graphene on Liquid Sn and Cu–Sn Alloy Substrates
por: Saeed, Maryam A., et al.
Publicado: (2020)

Calorimetric studies of Cu–Li, Li–Sn, and Cu–Li–Sn
por: Fürtauer, S., et al.
Publicado: (2013)

Reactions in Electrodeposited Cu/Sn and Cu/Ni/Sn Nanoscale Multilayers for Interconnects
por: Chia, Pay Ying, et al.
Publicado: (2016)

Enthalpies of Formation of (Cu,Ni)(3)Sn, (Cu,Ni)(6)Sn(5)-HT and (Ni,Cu)(3)Sn(2-)HT
por: Schmetterer, C., et al.
Publicado: (2014)

High efficiency Cu(2)MnSnS(4) thin film solar cells with SnS BSF and CdS ETL layers: A numerical simulation
por: Isha, Ahmmad, et al.
Publicado: (2023)

Synthesis of Ge(1−x)Sn(x) Alloy Thin Films by Rapid Thermal Annealing of Sputtered Ge/Sn/Ge Layers on Si Substrates
por: Mahmodi, Hadi, et al.
Publicado: (2018)

Thermoelectric Properties of Cu(2)SnSe(3)-SnS Composite
por: Siyar, Muhammad, et al.
Publicado: (2019)

Solution-Processed Cu(2)ZnSn(S,Se)(4) Thin-Film Solar Cells Using Elemental Cu, Zn, Sn, S, and Se Powders as Source
por: Guo, Jing, et al.
Publicado: (2015)

Study on the Optimization of Cu-Zn-Sn-O to Prepare Cu(2)ZnSnS(4) Thin Film via a Nano Ink Coating Method
por: Li, Qian, et al.
Publicado: (2021)

Filtering Efficiency of Sustainable Textile Materials Applied in Personal Protective Face Mask Production during Pandemic
por: Géczy, Attila, et al.
Publicado: (2023)

Effect of Cu-Sn Addition on Corrosion Property of Pressureless Sintered Fe-Cu-Co Substrate Alloys
por: Tao, Hongliang, et al.
Publicado: (2023)

Computational and experimental characterizations of annealed Cu(2)ZnSnS(4) thin films
por: Ahmad, Ahmad A., et al.
Publicado: (2021)

Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention
por: Li, M. Y., et al.
Publicado: (2016)

The crystal structure of (Nb$_{0.75}$Cu$_{0.25}$)Sn$_{2}$ in the Cu-Nb-Sn system
por: Martin, Stefan, et al.
Publicado: (2016)

Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn–Ag–Cu Solder on a Cu Substrate
por: Kang, Min-Soo, et al.
Publicado: (2019)

The Effect of Epoxy Polymer Addition in Sn-Ag-Cu and Sn-Bi Solder Joints
por: Kang, Min-Soo, et al.
Publicado: (2019)

Cu(3)Sn joint based on transient liquid phase bonding of Cu@Cu(6)Sn(5) core–shell particles
por: Wang, Jintao, et al.
Publicado: (2023)

Mechanochemical Synthesis of Sustainable Ternary and Quaternary Nanostructured Cu(2)SnS(3), Cu(2)ZnSnS(4), and Cu(2)ZnSnSe(4) Chalcogenides for Thermoelectric Applications
por: Nautiyal, Himanshu, et al.
Publicado: (2023)

Scanning 3DXRD Measurement of Grain Growth, Stress, and Formation of Cu(6)Sn(5) around a Tin Whisker during Heat Treatment
por: Hektor, Johan, et al.
Publicado: (2019)

Microstructure Influence of SACX0307-TiO(2) Composite Solder Joints on Thermal Properties of Power LED Assemblies
por: Skwarek, Agata, et al.
Publicado: (2020)

Synthesis and Characterization of Cu(2)FeSnS(4)–Cu(2)MnSnS(4) Solid Solution Microspheres
por: Waluś, Edyta, et al.
Publicado: (2020)

Solution-Based Synthesis and Characterization of Cu(2)ZnSnS(4) (CZTS) Thin Films
por: Syafiq, Ubaidah, et al.
Publicado: (2019)

Fabrication of Ag and Mn Co-Doped Cu(2)ZnSnS(4) Thin Film
por: Qiu, Lei, et al.
Publicado: (2019)

Effect of FeCoNiCrCu(0.5) High-entropy-alloy Substrate on Sn Grain Size in Sn-3.0Ag-0.5Cu Solder
por: Shen, Yu-An, et al.
Publicado: (2019)

Gel-based precursors for the high-performance of n-channel GaInSnZnO and p-channel CuGaSnSO thin-film transistors
por: Bukke, Ravindra Naik, et al.
Publicado: (2021)

Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy
por: Roduan, Siti Faqihah, et al.
Publicado: (2022)

Growth kinetics of Cu(6)Sn(5) intermetallic compound at liquid-solid interfaces in Cu/Sn/Cu interconnects under temperature gradient
por: Zhao, N., et al.
Publicado: (2015)

Size effect model on kinetics of interfacial reaction between Sn-xAg-yCu solders and Cu substrate
por: Huang, M. L., et al.
Publicado: (2014)

Growth kinetics of Cu(6)Sn(5) intermetallic compound in Cu-liquid Sn interfacial reaction enhanced by electric current
por: Feng, Jiayun, et al.
Publicado: (2018)

Production of Dense Cu-10Sn Part by Laser Powder Bed Fusion with Low Surface Roughness and High Dimensional Accuracy
por: Calignano, Flaviana, et al.
Publicado: (2022)

Enhanced Optical Response of SnS/SnS(2) Layered Heterostructure
por: Lin, Der-Yuh, et al.
Publicado: (2023)

Cu(2)ZnSn(S,Se)(4) thin-films prepared from selenized nanocrystals ink
por: Aruna-Devi, R., et al.
Publicado: (2019)

Cannot write session to /tmp/vufind_sessions/sess_3q71u2ookqapgcvghteu0bfjns