Damage Mechanism of Cu(6)Sn(5) Intermetallics Due to Cyclic Polymorphic Transitions

The formation of high-melting-point Cu(6)Sn(5) interconnections is crucial to overcome the collapse of Sn-based micro-bumps and to produce reliable intermetallic interconnections in three-dimensional (3D) packages. However, because of multiple reflows in 3D package manufacturing, Cu(6)Sn(5) intercon...

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Detalles Bibliográficos
Autores principales: Zhang, Zhihao, Wei, Cunwei, Cao, Huijun, Zhang, Ye
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6947464/
https://www.ncbi.nlm.nih.gov/pubmed/31835447
http://dx.doi.org/10.3390/ma12244127

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6947464/
https://www.ncbi.nlm.nih.gov/pubmed/31835447
http://dx.doi.org/10.3390/ma12244127

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