Enhancement of Solvent Resistance of Polyimide Electrospun Mat via the UV-Assisted Electrospinning and Photosensitive Varnish

A new methodology for enhancing the solvent resistance of electrospun polyimide (PI) ultrafine fibrous mat (UFM) was investigated in the current work. For this purpose, a negative intrinsically photosensitive polyimide (PSPI) resin was prepared by the one-step high- temperature polycondensation proc...

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Detalles Bibliográficos
Autores principales: Qi, Lin, Guo, Chen-Yu, Huang Fu, Meng-Ge, Zhang, Yan, Yin, Lu-meng, Wu, Lin, Liu, Jin-gang, Zhang, Xiu-min
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6960540/
https://www.ncbi.nlm.nih.gov/pubmed/31835683
http://dx.doi.org/10.3390/polym11122055

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6960540/
https://www.ncbi.nlm.nih.gov/pubmed/31835683
http://dx.doi.org/10.3390/polym11122055

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