IMCs Microstructure Evolution Dependence of Mechanical Properties for Ni/Sn/Ni Micro Solder-Joints

The current miniaturization trend of microelectronic devices drives the size of solder joints to continually scale down. The miniaturized joints considerably increase intermetallic compounds (IMCs) volume fraction to trigger mechanical reliability issues. This study investigated precise relationship...

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Detalles Bibliográficos
Autores principales: Ren, Ning, Fang, Heng, Wang, Dong, Hou, Chenyi, Zhao, Yatao, Chen, Fan, Tian, Ye, Paik, Kyung-Wook, Wu, Yiping
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6981565/
https://www.ncbi.nlm.nih.gov/pubmed/31935984
http://dx.doi.org/10.3390/ma13010252

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6981565/
https://www.ncbi.nlm.nih.gov/pubmed/31935984
http://dx.doi.org/10.3390/ma13010252

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