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IMCs Microstructure Evolution Dependence of Mechanical Properties for Ni/Sn/Ni Micro Solder-Joints
The current miniaturization trend of microelectronic devices drives the size of solder joints to continually scale down. The miniaturized joints considerably increase intermetallic compounds (IMCs) volume fraction to trigger mechanical reliability issues. This study investigated precise relationship...
Autores principales: | Ren, Ning, Fang, Heng, Wang, Dong, Hou, Chenyi, Zhao, Yatao, Chen, Fan, Tian, Ye, Paik, Kyung-Wook, Wu, Yiping |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2020
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6981565/ https://www.ncbi.nlm.nih.gov/pubmed/31935984 http://dx.doi.org/10.3390/ma13010252 |
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