Random Voids Generation and Effect of Thermal Shock Load on Mechanical Reliability of Light-Emitting Diode Flip Chip Solder Joints

To make the light-emitting diode (LED) more compact and effective, the flip chip solder joint is recommended in LED chip-scale packaging (CSP) with critical functions in mechanical support, heat dissipation, and electrical conductivity. However, the generation of voids always challenges the mechanic...

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Detalles Bibliográficos
Autores principales: Fan, Jiajie, Wu, Jie, Jiang, Changzhen, Zhang, Hao, Ibrahim, Mesfin, Deng, Liang
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2019
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6982262/
https://www.ncbi.nlm.nih.gov/pubmed/31878067
http://dx.doi.org/10.3390/ma13010094

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC6982262/
https://www.ncbi.nlm.nih.gov/pubmed/31878067
http://dx.doi.org/10.3390/ma13010094

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