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A FinFET with one atomic layer channel

Since its invention in the 1960s, one of the most significant evolutions of metal-oxide-semiconductor field effect transistors (MOS-FETs) would be the three dimensionalized version that makes the semiconducting channel vertically wrapped by conformal gate electrodes, also recognized as FinFET. Durin...

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Detalles Bibliográficos
Autores principales: Chen, Mao-Lin, Sun, Xingdan, Liu, Hang, Wang, Hanwen, Zhu, Qianbing, Wang, Shasha, Du, Haifeng, Dong, Baojuan, Zhang, Jing, Sun, Yun, Qiu, Song, Alava, Thomas, Liu, Song, Sun, Dong-Ming, Han, Zheng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: Nature Publishing Group UK 2020
Materias:
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7058032/
https://www.ncbi.nlm.nih.gov/pubmed/32139679
http://dx.doi.org/10.1038/s41467-020-15096-0
Descripción
Sumario:Since its invention in the 1960s, one of the most significant evolutions of metal-oxide-semiconductor field effect transistors (MOS-FETs) would be the three dimensionalized version that makes the semiconducting channel vertically wrapped by conformal gate electrodes, also recognized as FinFET. During the past decades, the width of fin (W[Formula: see text] ) in FinFETs has shrunk from about 150 nm to a few nanometers. However, W[Formula: see text] seems to have been levelling off in recent years, owing to the limitation of lithography precision. Here, we show that by adapting a template-growth method, different types of mono-layered two-dimensional crystals are isolated in a vertical manner. Based on this, FinFETs with one atomic layer fin are obtained, with on/off ratios reaching [Formula: see text] . Our findings push the FinFET to the sub 1 nm fin-width limit, and may shed light on the next generation nanoelectronics for higher integration and lower power consumption.