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Temperature Gradient Method for Alleviating Bonding-Induced Warpage in a High-Precision Capacitive MEMS Accelerometer
Capacitive MEMS accelerometers with area-variable periodic-electrode displacement transducers found wide applications in disaster monitoring, resource exploration and inertial navigation. The bonding-induced warpage, due to the difference in the coefficients of thermal expansion of the bonded slices...
Autores principales: | , , , , , , |
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Formato: | Online Artículo Texto |
Lenguaje: | English |
Publicado: |
MDPI
2020
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Materias: | |
Acceso en línea: | https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7071001/ https://www.ncbi.nlm.nih.gov/pubmed/32098077 http://dx.doi.org/10.3390/s20041186 |