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Temperature Gradient Method for Alleviating Bonding-Induced Warpage in a High-Precision Capacitive MEMS Accelerometer

Capacitive MEMS accelerometers with area-variable periodic-electrode displacement transducers found wide applications in disaster monitoring, resource exploration and inertial navigation. The bonding-induced warpage, due to the difference in the coefficients of thermal expansion of the bonded slices...

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Detalles Bibliográficos
Autores principales:	Liu, Dandan, Liu, Huafeng, Liu, Jinquan, Hu, Fangjing, Fan, Ji, Wu, Wenjie, Tu, Liangcheng
Formato:	Online Artículo Texto
Lenguaje:	English
Publicado:	MDPI 2020
Materias:	Article
Acceso en línea:	https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7071001/ https://www.ncbi.nlm.nih.gov/pubmed/32098077 http://dx.doi.org/10.3390/s20041186

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