Effect of Contact Plug Deposition Conditions on Junction Leakage and Contact Resistance in Multilevel CMOS Logic Interconnection Device

Here, we developed the optimal conditions in terms of physical and electrical characteristics of the barrier and tungsten (W) deposition process of a contact module, which is the segment connecting the device and the multi-layer metallization (MLM) metal line in the development of 100 nm-class logic...

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Detalles Bibliográficos
Autores principales: Cui, Yinhua, Jeong, Jeong Yeul, Gao, Yuan, Pyo, Sung Gyu
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7074618/
https://www.ncbi.nlm.nih.gov/pubmed/32041270
http://dx.doi.org/10.3390/mi11020170

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7074618/
https://www.ncbi.nlm.nih.gov/pubmed/32041270
http://dx.doi.org/10.3390/mi11020170

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