Dynamic Observation of Interfacial IMC Evolution and Fracture Mechanism of Sn2.5Ag0.7Cu0.1RE/Cu Lead-Free Solder Joints during Isothermal Aging

Dynamic observation of the microstructure evolution of Sn2.5Ag0.7Cu0.1RE/Cu solder joints and the relationship between the interfacial intermetallic compound (IMC) and the mechanical properties of the solder joints were investigated during isothermal aging. The results showed that the original singl...

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Detalles Bibliográficos
Autores principales: Zhao, Di, Zhang, Keke, Ma, Ning, Li, Shijie, Yin, Chenxiang, Huo, Fupeng
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Article
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7078696/
https://www.ncbi.nlm.nih.gov/pubmed/32059528
http://dx.doi.org/10.3390/ma13040831

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7078696/
https://www.ncbi.nlm.nih.gov/pubmed/32059528
http://dx.doi.org/10.3390/ma13040831

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