Powder Filling and Sintering of 3D In-chip Solenoid Coils with High Aspect Ratio Structure

In this study, a 3D coil embedded in a silicon substrate including densely distributed through-silicon vias (TSVs) was fabricated via a rapid metal powder sintering process. The filling and sintering methods for microdevices were evaluated, and the effects of powder types were compared. The paramete...

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Detalles Bibliográficos
Autores principales: Huang, Yujia, Li, Haiwang, Sun, Jiamian, Zhai, Yanxin, Li, Hanqing, Xu, Tiantong
Formato: Online Artículo Texto
Lenguaje:English
Publicado: MDPI 2020
Materias:
Communication
Acceso en línea:https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7142785/
https://www.ncbi.nlm.nih.gov/pubmed/32235795
http://dx.doi.org/10.3390/mi11030328

Internet

https://www.ncbi.nlm.nih.gov/pmc/articles/PMC7142785/
https://www.ncbi.nlm.nih.gov/pubmed/32235795
http://dx.doi.org/10.3390/mi11030328

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